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IC、晶体管插座
| 图片 | 型号 | 库存 | 价格 | 数量 | 规格书 | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
PLCC-20-ATPLCC 20P THROUGH HOLE Adam Tech |
637 | - |
立即询盘 |
规格书 |
Tube | PLCC | Active | PLCC | 20 (4 x 5) | 0.050 (1.27mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
ICM-628-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 28P Adam Tech |
240 | - |
立即询盘 |
规格书 |
Tube | ICM | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
PLCC-32-ATPLCC 32P THROUGH HOLE Adam Tech |
3,665 | - |
立即询盘 |
规格书 |
Tube | PLCC | Active | PLCC | 32 (2 x 7, 2 x 9) | 0.050 (1.27mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
ICM-328-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 28P Adam Tech |
2,946 | - |
立即询盘 |
规格书 |
Tube | ICM | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
PLCC-68-AT-SMTCONN SOCKET PLCC 68POS PHOS BRNZ Adam Tech |
323 | - |
立即询盘 |
规格书 |
Tube | PLCC | Active | PLCC | 68 (4 x 17) | 0.050 (1.27mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
ICM-632-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 32P Adam Tech |
365 | - |
立即询盘 |
规格书 |
Tube | ICM | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
PLCC-84-ATPLCC 84P THROUGH HOLE Adam Tech |
116 | - |
立即询盘 |
规格书 |
Tube | PLCC | Active | PLCC | 84 (4 x 21) | 0.050 (1.27mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
ICM-640-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 40P Adam Tech |
479 | - |
立即询盘 |
规格书 |
Tube | ICM | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
ICM-648-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 48P Adam Tech |
851 | - |
立即询盘 |
规格书 |
Tube | ICM | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
PLCC-52-ATPLCC 52P THROUGH HOLE Adam Tech |
275 | - |
立即询盘 |
规格书 |
Tube | PLCC | Active | PLCC | 52 (4 x 13) | 0.050 (1.27mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
PLCC-68-ATPLCC 68P THROUGH HOLE Adam Tech |
1,216 | - |
立即询盘 |
规格书 |
Tube | PLCC | Active | PLCC | 68 (4 x 17) | 0.050 (1.27mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
ICM-324-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 24P Adam Tech |
190 | - |
立即询盘 |
规格书 |
Tube | ICM | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
PLCC-84-AT-SMTPLCC SOCKET 84P SMT Adam Tech |
448 | - |
立即询盘 |
规格书 |
Tube | PLCC | Active | PLCC | 84 (4 x 21) | 0.050 (1.27mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
ICS-316-TIC SOCKET, DIP, 16P 2.54MM PITCH Adam Tech |
3,843 | - |
立即询盘 |
规格书 |
Tube | ICS | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
ICS-624-TIC SOCKET, DIP, 24P 2.54MM PITCH Adam Tech |
2,879 | - |
立即询盘 |
规格书 |
Tube | ICS | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
ICM-314-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 14P Adam Tech |
2,863 | - |
立即询盘 |
规格书 |
Tube | ICM | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
ICM-316-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 16P Adam Tech |
3,843 | - |
立即询盘 |
规格书 |
Tube | ICM | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Polyphenylene Sulfide (PPS) |
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