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IC、晶体管插座

型号	库存	价格	数量	规格书	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
TDU03DTON CONN SOCKET TRANSIST 3POS GOLD Sullins Connector Solutions	893	-	立即询盘	规格书	Tray	-	Active	Transistor	3 (Rectangular)	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Board Guide	Solder	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
214-3339-00-0602J CONN IC DIP SOCKET ZIF 14POS GLD 3M	189	-	立即询盘	规格书	Tube	Textool™	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled
224-1275-00-0602J CONN IC DIP SOCKET ZIF 24POS GLD 3M	2,825	-	立即询盘	规格书	Tube	Textool™	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled
1-2324271-3 RIGHT SEGMEN LGA4189-4 SOCKET-P4 TE Connectivity AMP Connectors	5,113	-	立即询盘	规格书	Tray	-	Active	LGA 4189	2092	0.039 (1.00mm)	Gold	15.0µin (0.38µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.034 (0.86mm)	Gold	15.0µin (0.38µm)	Copper Alloy	Thermoplastic
1-2324271-4 LEFT SEGMEN LGA4189-4 SOCKET-P4 TE Connectivity AMP Connectors	4,833	-	立即询盘	规格书	Tray	-	Active	LGA 4189	2092	0.039 (1.00mm)	Gold	15.0µin (0.38µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.034 (0.86mm)	Gold	15.0µin (0.38µm)	Copper Alloy	Thermoplastic
220-3342-00-0602J CONN IC DIP SOCKET ZIF 20POS GLD 3M	2,032	-	立即询盘	规格书	Tube	Textool™	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled
208-7391-55-1902 CONN SOCKET SOIC 8POS GOLD 3M	325	-	立即询盘	规格书	Bulk	Textool™	Active	SOIC	8 (2 x 4)	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Polyethersulfone (PES), Glass Filled
2-2129710-5 CONN SOCKET LGA 3647POS GOLD TE Connectivity AMP Connectors	654	-	立即询盘	规格书	Tray	-	Active	LGA	3647	-	Gold	30.0µin (0.76µm)	Copper Alloy	Surface Mount	Open Frame	Solder	-	-	-	Copper Alloy	Thermoplastic
2-2129710-6 CONN SOCKET LGA 3647POS GOLD TE Connectivity AMP Connectors	1,188	-	立即询盘	规格书	Tray	-	Active	LGA	3647	-	Gold	30.0µin (0.76µm)	Copper Alloy	Surface Mount	Open Frame	Solder	-	-	-	Copper Alloy	Thermoplastic
248-1282-00-0602J CONN IC DIP SOCKET ZIF 48POS GLD 3M	181	-	立即询盘	规格书	Tube	Textool™	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled
216-7224-55-1902 CONN SOCKET SOIC 16POS GOLD 3M	345	-	立即询盘	规格书	Bulk	Textool™	Active	SOIC	16 (2 x 8)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Polyethersulfone (PES), Glass Filled
203-2737-55-1102 CONN TRANSIST TO-3/TO-66 3POS 3M	295	-	立即询盘	规格书	Bulk	Textool™	Active	Transistor, TO-3 and TO-66	3 (Rectangular)	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.234 (5.94mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
210-2599-00-0602 CONN SOCKET SIP ZIF 10POS GOLD 3M	210	-	立即询盘	规格书	Bulk	Textool™	Active	SIP, ZIF (ZIP)	10 (1 x 10)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled
220-2600-00-0602 CONN SOCKET SIP ZIF 20POS GOLD 3M	496	-	立即询盘	规格书	Bulk	Textool™	Active	SIP, ZIF (ZIP)	20 (1 x 20)	0.100 (2.54mm)	Gold	-	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled
169-PRS13001-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	135	-	立即询盘	规格书	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
225-PRS15001-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	127	-	立即询盘	规格书	Bulk	PRS	Active	PGA, ZIF (ZIP)	225 (15 x 15)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
289-PRS17001-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3,350	-	立即询盘	规格书	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
361-PRS19001-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3,657	-	立即询盘	规格书	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
441-PRS21001-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3,081	-	立即询盘	规格书	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
ICS-306-T IC SOCKET, DIP, 6P 2.54MM PITCH Adam Tech	9,260	-	立即询盘	规格书	Tube	ICS	Active	DIP, 0.3 (7.62mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled